Frame-mounted adhesive tape is used to hold wafers for dicing. The wafer needs to adhere to the tape well enough to make it through the dicing and cleaning process, but the die need to be easily removable.
Tape is unwound from a roll and mounted to the wafer and frame at a consistent temperature and pressure. The frame has orientation notches that must be correctly positioned relative to the flat or orientation notch on the wafer. The circuit side of the wafer must not make contact with the chuck in some cases, because of fragile structures in the circuit. Air must not be trapped as the tape is applied to the wafer. The tension in the tape should be equal in all directions around the mounted wafer. Unequal tension can cause a shift during dicing.
Various options for mounting tape include thermal release and UV light release.