Aptek is proud to announce that it has expanded its product offering of services. Through a new state of the art vertical integration program, we can now offer turnkey solutions from bare silicon all the way through to dicing and beyond. 

Our expanded services has moved into lapping services for harder materials such as Sapphire, Quartz and Silicon Carbide. Lapping also gives an alternative for softer materials as well, should you need a different surface finish. So, even if your process is not wafer related. chances are, we have a solution.  

After your wafers are thinned, we’ll move them to backside metal processing should you require it. Then it is on to dicing for a multitude of options to meet your packaging needs. Dice into waffle packs, dice into gel packs or simply leave the diced wafer on a frame. We can do it all.

Go to our quick quote page, select the services you need and you’re done. We’ll work up a Total Solution Quote based on your information. Should we need additional information, we’ll contact you for clarification.


Lapping                     Grind                Grind & CMP Polish

 Backside Metal Deposition              Edge Grinding

Laser Servies        Tape Mount