Aptek’s processes are ideal for removing the diode from the wafer’s backside and for thinning the wafers to fit flatpac packaging. With our proprietary processes, we can thin wafers from two to twelve inches (50-300 mm) in diameter, to thicknesses down to 4 mils (100 microns), with a tolerance of .5 mils (12 microns) guaranteed. Our services include backside polishing with a thickness down to 1 mil (25-30 microns), backside gold removal and grinding of ceramic substrates, germanium, sapphire, gallium arsenide, and other materials.