Edge grinding, aka Edge Profiling, is critical to the manufacturing of all semiconductor wafers and wafers that are used in the manufacture of many other processes, such as Sapphire, Quartz, Alumina or Silicon Carbide.
Edge grinding is critical to the safety and survivability of the wafer. Silicon in it’s crystalline state is very brittle and if the edge is not profiled or rounded off, it could crack or break during handling and certainly during follow-on processing steps. Thermal fluctuations as well as robotic handling can lead to catastrophic results as a result of the wafers not having a well rounded or notched edge. Discuss with us your concerns or requirements. chances are we have a solution to satisfy your specifications.